Adeia’s Innovative Solutions for AI:
Hybrid Bonding and RapidCool™
Design and Experimental Validation of Partitioned Flow Strategies for Optimized Microchannel Cooling
Thursday, May 28, 2026
8:00am in Room 3
ITherm Session: Liquid Cooling Solutions and System Integration
This paper explores advanced microchannel cooling architecture, introducing partitioned flow strategies that enhance thermal efficiency and enable more effective heat dissipation for high-density semiconductor devices.
Presented by: Dr. Ron Zhang, VP of Advanced Packaging and Thermal Solutions
Dr. Ron Zhang leads the Advanced Packaging and Thermal Solutions team at Adeia, driving innovation in packaging integration and data center cooling. He is recognized for his work in system-level architecture bridging device, package, and infrastructure to enable next-generation AI systems. He has contributed to co-packaged optics and direct liquid cooling solutions. Dr. Zhang earned his Ph.D. in Mechanical Engineering and Applied Mechanics from the University of Michigan.
Advances in Direct-to-Chip Liquid Cooling Integration
Thursday, May 28, 2026
11:55am in Palazzo D
ECTC Session 13: Advances in Thermal Design and Characterization
This work highlights innovations in direct-to-chip liquid cooling integration, addressing the thermal challenges of AI hardware and compute-intensive workloads.
Presented by: Dr. Laura Mirkarimi, SVP of Semiconductor Engineering
Dr. Laura Mirkarimi leads the Semiconductor Engineering team at Adeia, driving innovation in advanced packaging, metrology, and thermal solutions. She is widely recognized for her pioneering work in hybrid bonding and continues to focus on key technologies enabling future generations of electronic products. She has over 100 granted patents and has authored more than 60 technical publications in her career. Dr. Mirkarimi earned her Ph.D. in Materials Engineering from Northwestern University and her B.S. in Ceramic Science and Engineering from Pennsylvania State University.
Reworkable Die-to-Wafer Hybrid Bonding Process
Friday, May 29, 2026
2:40pm in Palazzo D
ECTC Session 31: 3D Integration, TSV, and Hybrid Bonding Innovations
This paper introduces a reworkable hybrid bonding process that enhances manufacturability and yield in advanced packaging, supporting scalable 3D integration.
Presented by: Dr. Rajan Gangadharan, Principal Engineer
Dr. Rajan Gangadharan specializes in advanced packaging technologies for next-generation semiconductor applications. His work focuses on hybrid bonding, liquid cooling, and process integration, supporting innovation from research through high-volume manufacturing. He has extensive experience across semiconductor processing, electrochemical materials, biosensors, and photovoltaics, and holds multiple patents and technical publications. Dr. Gangadharan earned his Ph.D. in Bioengineering from Clemson University.
